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A3PE3000L-1FGG484M

ProASIC3 Low Power FPGA, 35KLEs
Lead Count: 484
Package Type: PBGA
Packing Media: Tray (1)
Temp Range: -55C to +125C
Country of Origin (COO): Philippines

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A3PE3000L-1FGG484M

ProASIC3E, the third-generation family of Microsemi flash FPGAs, offers performance, density, and features beyond those of the ProASICplus family. Nonvolatile flash technology gives ProASIC3E devices the advantage of being a secure, low power, single-chip solution that is Instant On. ProASIC3E is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools. ProASIC3E devices offer 1 kbit of on-chip, programmable, nonvolatile FlashROM storage as well as dock conditioning circuitry based on six integrated phase-locked loops (PLLs). ProASIC3E devices have up to three million system gates, supported with up to 504 kbits of true dual-port SRAM and up to 620 user I/Os. Several ProASIC3E devices support the Cortex-M1 soft IP cores, and the ARM-Enabled devices have Microsemi ordering numbers that begin with M1A3PE.


  • High Capacity

    • 600 k to 3 Million System Gates

    • 108 to 504 kbits of True Dual-Port SRAM

    • Up to 620 User I/Os

  • Reprogrammable Flash Technology

    • 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

    • Instant On Level 0 Support

    • Single-Chip Solution

    • Retains Programmed Design when Powered Off

  • On-Chip User Nonvolatile Memory

    • 1 kbit of FlashROM with Synchronous Interfacing

  • High Performance

    • 350 MHz System Performance

    • 3.3 V, 66 MHz 64-Bit PCI

  • In-System Programming (ISP) and Security

    • ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption via JTAG (IEEE 1532–compliant)

    • FlashLock® Designed to Secure FPGA Contents

  • Low Power

    • Core Voltage for Low Power

    • Support for 1.5-V-Only Systems

    • Low-Impedance Flash Switches

  • High-Performance Routing Hierarchy

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